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LID World Summit 2026: Lab-to-Market Transition To Sustainable Chips Powers Next Wave of AI Factories

​​​28th Annual Gathering Brings 1,250+ International Industry Leaders to Grenoble ​​​To Accelerate the Transition From R&D to Commercial Deployment​

Published on 30 April 2026

GRENOBLE, France – April 30, 2026 – CEA-Leti's three-day conference,LID World Summit 2026 (June 23-25), will explore the semiconductor industry's critical transition from lab-to-fab to lab-to-market structures, powered by sustainable chips, essential to next-generation AI factories.

With the theme of “Lab to Market with Sustainable Chips to Power the Next Wave of AI Factories", the 28th edition of the LID World Summit will showcase innovations that advance European technological sovereignty and chip competitiveness, while strengthening industry capacity to support accelerating demand for advanced AI semiconductors.

"In a world of constant disruption, technological innovation must m​ove faster and aim higher. LID World Summit is where leaders unite to transform rapid acceleration into real-world impact through the power of collaboration," said Sébastien Dauvé, CEA-Leti CEO.​

What to​ Expect

  • 1,250 international attendees
  • 400 companies expected
  • 160+ high-level speakers
  • 11 conferences
  • 30live de​mos
  • 1,000 m² exhibition space
  • 90 exhibitors, sponsors, and st​artups

​Technical Co​​​​​​​nferences

In addition to presenting timely perspectives on strategic technologies driving international competitiveness, this year's event will offer 11 technical conferences covering topics such as​​​ data & network/cloud convergence, semiconductors for computing and defense, cybersecurity, the FAMES Pilot Line, the RESOLVE Initiative, and startups and investments.  


New for 2​​026

Startups an​​​d Investments:  Emerging technologies and investments across deep tech—from early-stage ventures to growth-ready companies shaping the next industrial wave.

Closing Confer​ence:  Disruptive Digital Interfaces: decoding the next wave of digital experiences featuring a special guest ​​speaker.

The LID World Summit is CEA-Leti's signature international event and largest annual gathering. It anchors a series of tech events including LID Taiwan, LID Interconnect, LID Austin, LID Silicon Valley, LID Tokyo, LID Tech Connect and LID Photonics. These events highlight technological breakthroughs and collaboration across sectors responding to society's pressing challenges in mobility, healthcare, telecom, low-carbon energy, space, and defense & security.

Click he​​​re   to see details of event keynotes, conferences & presentations.​​